# [Japan] Tohoku University – Engineering Short Program Summer 2026

**Source**: https://oia.ugm.ac.id/2026/03/16/japan-tohoku-university-engineering-short-program-summer-2026/
**Parent**: https://oia.ugm.ac.id/

Greetings from **Japan!**

**Tohoku University** is a prestigious research university located in Sendai, Miyagi Prefecture, Japan. It is one of the country’s most prominent and comprehensive universities, known for its excellence in education and research across various fields.

We are pleased to inform you that the application for **Tohoku University Engineering Short Program 2026** is now **open.**

[Website](https://sites.google.com/tohoku.ac.jp/tesp/summer-program)

**ABOUT THE PROGRAM\**This program provides students with an opportunity to study and engage with advanced engineering topics while experiencing academic life in Japan. The Summer 2026 program will offer a Robotics/Materials Engineering course.

Dates: July 9–24, 2026\
Location: Sendai, Japan\
Program fee: JPY 90,000 (accommodation not included)\
Application & Nomination deadline: April 15, 2026 (JST)

**ELIGIBILITY**

1. Undergraduate students (S1) or Graduate students (S2/S3)
2. Enrolled in Universitas Gadjah Mada during the program
3. Minimum GPA of 3.0 on a 4.0 scale
4. Be proficient in English

 

**REQUIRED DOCUMENTS**

1. Official Academic Transcript
2. English Language Proficiency
3. Letter of Enrollment from Faculty
4. Letter of Nomination from Faculty (addressed to the Head of Office of International Affairs UGM)
5. Letter of Recommendation from the Academic Advisor
6. Curriculum Vitae (with a portrait photo)
7. Motivation Letter
8. Colored Copy of Passport
9. Confirmation Letter of Participation ([download](http://oia.ugm.ac.id/wp-content/uploads/sites/326/2019/01/Confirmation-Letter-of-Participation-Outgoing-Mobility-UGM.pdf))
10. Passport Size Photo

 

**APPLICATION PROCEDURE**

1. Apply directly to **Tohoku University**
2. Kindly refer to [this link](https://sites.google.com/tohoku.ac.jp/tesp/summer-program/application) before **15 April 2026**
3. The **FINAL** decision is from  ****Tohoku University****

**IMPORTANT NOTES**

- In the meantime, the students are required to keep the hard file of all documents until further notice by the Office of International Affairs.
- In case the faculty could not provide the letter of enrollment and nomination during this period, the official nomination through email from the faculty is acceptable. The official nomination could be delivered to head-oia@ugm.ac.id (cc to scholarship@ugm.ac.id)

 

**CONSULTATION INFO**

If you have any questions regarding this program, you can contact us in OIA’s office hour:

- WhatsApp: +62 812-1888-7818 (WA)
- Email: scholarship@ugm.ac.id

Virtual consultation: <https://ugm.id/AppointmentOIAUGM>