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Source: https://oia.nycu.edu.tw/oia/en/app/openData/data/list?module=nycu0018&mserno=6c6e24cf-084a-4830-b5db-0933ad97b511&type=xml&id=828 Parent: https://oia.nycu.edu.tw/oia/en/app/data/list?module=nycu0018&id=828
Division of Strategic Planninghttps://oia.nycu.edu.tw/oia/en/app/data/image?module=nycu0018&detailNo=1414796009065680896&init=YGroup photo at the STIPT 2025/26 Opening Meeting (NYCU)https://oia.nycu.edu.tw/oia/en/app/data/image?module=nycu0018&detailNo=1414796009111818240&init=YRemarks and dialogue with participants. Left: Dr. Josef Goldberger, Liaison Officer, Saxon Science Liaison Office Taiwan / Right: Dr. Wensyang Hsu, Vice President for International Affairs, NYCUhttps://oia.nycu.edu.tw/oia/en/app/data/image?module=nycu0018&detailNo=1414796009178927104&init=YTSMC representatives answering questions from studentshttps://oia.nycu.edu.tw/oia/en/app/data/image?module=nycu0018&detailNo=1414796009225064448&init=YQ&A and plenary session
On September 2, 2025, National Yang Ming Chiao Tung University (NYCU) hosted the opening meeting for the Semiconductor Talent Incubation Program Taiwan (STIPT) Winter Semester 2025/26 cohort. Ten undergraduate and master’s students from the Free State of Saxony have arrived at NYCU to pursue a semester of module-based coursework. Four representatives from TSMC’s HR project team joined the session, alongside NYCU representatives including VP for International Affairs Prof. Wensyang Hsu, Section Chief Li-Wei Chan, Prof. Tsai-Hsuan "Belody" Luo, and Prof. Shih-Hsin Chen, together with colleagues from the Office of International Affairs.
STIPT is a Saxony–Taiwan initiative jointly supported by the Free State of Saxony, TU Dresden, and TSMC, combining university modules in Taiwan with hands-on training at TSMC. For the Winter Semester 2025/26, academic modules are hosted by NYCU and National Taiwan University of Science and Technology. Upon completion of the university coursework, students proceed to TSMC’s Newcomer Training Center and fab in Taichung for approximately two months of professional training (planned for Dec 205 – Feb 2026).
After onboarding, students will complete module courses at NYCU with academic and student-life advising, and then transition to TSMC’s professional training—gaining practical exposure to manufacturing environments and equipment processes, and strengthening technical and intercultural competencies. For more information, please refer to the STIPT page by the Leonardo Office at TU Dresden.