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Design and Simulation of a Superconducting Qubit
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general
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20b2878a47c14ee5992d9b18d9c4bde9
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Design and Simulation of a Superconducting Qubit

Source: https://repository.tudelft.nl/record/uuid:645d46d4-55c1-49be-aeb4-0cbf4b39667b Parent: https://radar.tudelft.nl/Education/mscstudents.php

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Design and Simulation of a Superconducting Qubit

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Master Thesis (2025)

Author(s)

Y. Gao (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Contributor(s)

Alexander Yarovoy – Mentor (TU Delft - Microwave Sensing, Signals & Systems)

S.N. Haider – Mentor (TU Delft - QCD/Haider Group)

M. Spirito – Graduation committee member (TU Delft - Electronics)

Faculty

Electrical Engineering, Mathematics and Computer Science

Transmon qubits Electromagnetic Analysis Capacitance Superconducting qubits

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Publication Year

2025

Language

English

Graduation Date

29-08-2025

Awarding Institution

Delft University of Technology

Programme

['Electrical Engineering | Microelectronics']

Faculty

Electrical Engineering, Mathematics and Computer Science

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Abstract

Quantum bits (qubits) are regarded as the building blocks of a quantum computer, which have significant implications in quantum information science. The superconducting qubit is a solid platform for quantum computing, where the Transmon qubit based on the Josephson junction or the SQUID structure is widely designed and researched. Microwave design and electromagnetic simulation of a superconducting qubit is a crucial way to determine and enhance the qubit performance in reality. The geometry of a superconducting qubit structure should be optimized to achieve the desired equivalent capacitance and consequently the resonant frequency through the external magnetic flux adjustment. In this thesis, a special superconducting qubit for lower energy loss named 'Pokemon' qubit is analyzed, with the role of different capacitance geometry in the qubit studied. This thesis also presented a comparative analysis between the in-plane capacitive structure and the flip-chip capacitance. The results pave the way for future modular quantum processing units utilizing flip-chip technology.

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